? semiconductor components industries, llc, 2001 july, 2001 rev. 10 1 publication order number: mc74hc245a/d mc74hc245a octal 3-state noninverting bus transceiver highperformance silicongate cmos the mc74hc245a is identical in pinout to the ls245. the device inputs are compatible with standard cmos outputs; with pullup resistors, they are compatible with lsttl outputs. the hc245a is a 3state noninverting transceiver that is used for 2way asynchronous communication between data buses. the device has an activelow output enable pin, which is used to place the i/o ports into highimpedance states. the direction control determines whether data flows from a to b or from b to a. ? output drive capability: 15 lsttl loads ? outputs directly interface to cmos, nmos, and ttl ? operating voltage range: 2 to 6 v ? low input current: 1 a ? high noise immunity characteristic of cmos devices ? in compliance with the requirements defined by jedec standard no. 7a ? moisture sensitivity: msl1 for all packages ? chip complexity: 308 fets or 77 equivalent gates http://onsemi.com marking diagrams device package shipping ordering information tssop20 75 units/rail tssop20 2500 tape & reel mc74hc245an pdip20 mc74hc245adwr2 soic20 38 units/rail mc74hc245adw 18 units/rail mc74hc245adt soic20 1000 tape & reel mc74hc245adtr2 tssop20 dt suffix case 948e hc245a alyw 20 1 so20 dw suffix case 751d 1 20 hc245a awlyyww pdip20 n suffix case 783 1 20 mc74hc245an awlyyww a = assembly location l, wl = wafer lot y, yy = year w, ww = work week
mc74hc245a http://onsemi.com 2 figure 1. pin assignment a5 a3 a2 a1 direction gnd a8 a7 a6 a4 5 4 3 2 1 10 9 8 7 6 14 15 16 17 18 19 20 11 12 13 b3 b2 b1 output enable v cc b8 b7 b6 b5 b4 function table control inputs output enable direction operation l l data transmitted from bus b to bus a l h data transmitted from bus a to bus b h x buses isolated (highimpedance state) x = don't care a data port a8 a7 a6 a5 a3 a4 a2 a1 9 8 7 6 5 4 3 2 direction output enable 1 19 pin 10 = gnd pin 20 = v cc 18 17 16 15 14 13 12 11 b1 b2 b3 b4 b5 b6 b7 b8 b data port figure 2. logic diagram
mc74hc245a http://onsemi.com 3 maximum ratings (note 1.) symbol parameter value unit v cc dc supply voltage 0.5 to 7.0 v v in dc input voltage 0.5 to v cc 0.5 v v out dc output voltage (note 2.) 0.5 to v cc 0.5 v i ik dc input diode current 20 ma i ok dc output diode current 35 ma i out dc output sink current 35 ma i cc dc supply current per supply pin 75 ma i gnd dc ground current per ground pin 75 ma t stg storage temperature range 65 to 150 c t l lead temperature, 1 mm from case for 10 seconds 260 c t j junction temperature under bias 150 c ja thermal resistance pdip soic tssop 67 96 128 c/w p d power dissipation in still air at 85 c pdip soic tssop 750 500 450 mw msl moisture sensitivity level 1 f r flammability rating oxygen index: 30% to 35% ul 94 v0 @ 0.125 in v esd esd withstand voltage human body model (note 3.) machine model (note 4.) charged device model (note 5.) 2000 200 1000 v i latchup latchup performance above v cc and below gnd at 85 c (note 6.) 300 ma maximum ratings are those values beyond which damage to the device may occur. exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. functional operation under absolutemaximumrated conditions is not implied. functional operation should be restricted to the recommended operating conditions. 1. measured with minimum pad spacing on an fr4 board, using 10 mmby1 inch, 20 ounce copper trace with no air flow. 2. i o absolute maximum rating must observed. 3. tested to eia/jesd22a114a. 4. tested to eia/jesd22a115a. 5. tested to jesd22c101a. 6. tested to eia/jesd78. recommended operating conditions ???? ???? symbol ??????????????????? ??????????????????? parameter ?????? ?????? min ?????? ?????? max ?? ?? unit ???? ???? v cc ??????????????????? ??????????????????? dc supply voltage (referenced to gnd) ?????? ?????? 2.0 ?????? ?????? 6.0 ?? ?? v ???? ???? v in , v out ??????????????????? ??????????????????? dc input voltage, output voltage (referenced to gnd) ?????? ?????? 0 ?????? ?????? v cc ?? ?? v ???? ???? t a ??????????????????? ??????????????????? operating temperature, all package types ?????? ?????? 55 ?????? ?????? +125 ?? ?? c ???? ? ?? ? ? ?? ? ???? t r , t f ??????????????????? ? ????????????????? ? ? ????????????????? ? ??????????????????? input rise and fall time v cc = 2.0 v (figure 3) v cc = 4.5 v v cc = 6.0 v ?????? ? ???? ? ? ???? ? ?????? 0 0 0 ?????? ? ???? ? ? ???? ? ?????? 1000 500 400 ?? ?? ?? ?? ns
mc74hc245a http://onsemi.com 4 dc electrical characteristics (voltages referenced to gnd) ???? ???? ????????? ????????? ????????? ????????? ???? ???? ?????????? ?????????? guaranteed limit ?? ?? ???? ???? symbol ????????? ????????? parameter ????????? ????????? test conditions ???? ???? v cc v ???? ???? 55 to 25 c ???? ???? 85 c ???? ???? 125 c ?? ?? unit ???? ? ?? ? ? ?? ? ???? v ih ????????? ? ??????? ? ? ??????? ? ????????? minimum highlevel input voltage ????????? ? ??????? ? ? ??????? ? ????????? v out = v cc 0.1 v |i out | 20 a ???? ? ?? ? ? ?? ? ???? 2.0 3.0 4.5 6.0 ???? ? ?? ? ? ?? ? ???? 1.5 2.1 3.15 4.2 ???? ? ?? ? ? ?? ? ???? 1.5 2.1 3.15 4.2 ???? ? ?? ? ? ?? ? ???? 1.5 2.1 3.15 4.2 ?? ?? ?? ?? v ???? ? ?? ? ? ?? ? ???? v il ????????? ? ??????? ? ? ??????? ? ????????? maximum lowlevel input voltage ????????? ? ??????? ? ? ??????? ? ????????? v out = 0.1 v |i out | 20 a ???? ? ?? ? ? ?? ? ???? 2.0 3.0 4.5 6.0 ???? ? ?? ? ? ?? ? ???? 0.5 0.9 1.35 1.8 ???? ? ?? ? ? ?? ? ???? 0.5 0.9 1.35 1.8 ???? ? ?? ? ? ?? ? ???? 0.5 0.9 1.35 1.8 ?? ?? ?? ?? v ???? ? ?? ? ???? v oh ????????? ? ??????? ? ????????? minimum highlevel output voltage ????????? ? ??????? ? ????????? v in = v ih |i out | 20 a ???? ? ?? ? ???? 2.0 4.5 6.0 ???? ? ?? ? ???? 1.9 4.4 5.9 ???? ? ?? ? ???? 1.9 4.4 5.9 ???? ? ?? ? ???? 1.9 4.4 5.9 ?? ?? ?? v ???? ? ?? ? ???? ????????? ? ??????? ? ????????? ????????? ? ??????? ? ????????? v in = v ih |i out | 2.4 ma |i out | 6.0 ma |i out | 7.8 ma ???? ? ?? ? ???? 3.0 4.5 6.0 ???? ? ?? ? ???? 2.48 3.98 5.48 ???? ? ?? ? ???? 2.34 3.84 5.34 ???? ? ?? ? ???? 2.2 3.7 5.2 ?? ?? ?? ???? ? ?? ? ???? v ol ????????? ? ??????? ? ????????? maximum lowlevel output voltage ????????? ? ??????? ? ????????? v in = v il |i out | 20 a ???? ? ?? ? ???? 2.0 4.5 6.0 ???? ? ?? ? ???? 0.1 0.1 0.1 ???? ? ?? ? ???? 0.1 0.1 0.1 ???? ? ?? ? ???? 0.1 0.1 0.1 ?? ?? ?? v ???? ? ?? ? ???? ????????? ? ??????? ? ????????? ????????? ? ??????? ? ????????? v in = v il |i out | 2.4 ma |i out | 6.0 ma |i out | 7.8 ma ???? ? ?? ? ???? 3.0 4.5 6.0 ???? ? ?? ? ???? 0.26 0.26 0.26 ???? ? ?? ? ???? 0.33 0.33 0.33 ???? ? ?? ? ???? 0.4 0.4 0.4 ?? ?? ?? ???? ???? i in ????????? ????????? maximum input leakage current ????????? ????????? v in = v cc or gnd ???? ???? 6.0 ???? ???? 0.1 ???? ???? 1.0 ???? ???? 1.0 ?? ?? a ???? ? ?? ? ???? i oz ????????? ? ??????? ? ????????? maximum threestate leakage current ????????? ? ??????? ? ????????? output in highimpedance state v in = v il or v ih v out = v cc or gnd ???? ? ?? ? ???? 6.0 ???? ? ?? ? ???? 0.5 ???? ? ?? ? ???? 5.0 ???? ? ?? ? ???? 10 ?? ?? ?? a ???? ? ?? ? ???? i cc ????????? ? ??????? ? ????????? maximum quiescent supply current (per package) ????????? ? ??????? ? ????????? v in = v cc or gnd i out = 0 a ???? ? ?? ? ???? 6.0 ???? ? ?? ? ???? 4.0 ???? ? ?? ? ???? 40 ???? ? ?? ? ???? 160 ?? ?? ?? a 7. information on typical parametric values and high frequency or heavy load considerations can be found in the on semic onductor highspeed cmos data book (dl129/d). ac electrical characteristics (c l = 50 pf, input t r = t f = 6 ns) ???? ????????????????? ???? v cc ?????????? guaranteed limit ?? ???? ???? symbol ????????????????? ????????????????? parameter ???? ???? v cc v ???? ???? 55 to 25 c ???? ???? 85 c ???? ???? 125 c ?? ?? unit ???? ? ?? ? ? ?? ? ???? t plh , t phl ????????????????? ? ??????????????? ? ? ??????????????? ? ????????????????? maximum propagation delay, a to b, b to a (figures 1 and 3) ???? ? ?? ? ? ?? ? ???? 2.0 3.0 4.5 6.0 ???? ? ?? ? ? ?? ? ???? 75 55 15 13 ???? ? ?? ? ? ?? ? ???? 95 70 19 16 ???? ? ?? ? ? ?? ? ???? 110 80 22 19 ?? ?? ?? ?? ns ???? ? ?? ? ? ?? ? ???? t plz , t phz ????????????????? ? ??????????????? ? ? ??????????????? ? ????????????????? maximum propagation delay, direction or output enable to a or b (figures 2 and 4) ???? ? ?? ? ? ?? ? ???? 2.0 3.0 4.5 6.0 ???? ? ?? ? ? ?? ? ???? 110 90 22 19 ???? ? ?? ? ? ?? ? ???? 140 110 28 24 ???? ? ?? ? ? ?? ? ???? 165 130 33 28 ?? ?? ?? ?? ns ???? ? ?? ? ? ?? ? ???? t pzl , t pzh ????????????????? ? ??????????????? ? ? ??????????????? ? ????????????????? maximum propagation delay, output enable to a or b (figures 2 and 4) ???? ? ?? ? ? ?? ? ???? 2.0 3.0 4.5 6.0 ???? ? ?? ? ? ?? ? ???? 110 90 22 19 ???? ? ?? ? ? ?? ? ???? 140 110 28 24 ???? ? ?? ? ? ?? ? ???? 165 130 33 28 ?? ?? ?? ?? ns ???? ? ?? ? ???? t tlh , t thl ????????????????? ? ??????????????? ? ????????????????? maximum output transition time, any output (figures 1 and 3) ???? ? ?? ? ???? 2.0 3.0 4.5 6.0 ???? ? ?? ? ???? 60 23 12 10 ???? ? ?? ? ???? 75 27 15 13 ???? ? ?? ? ???? 90 32 18 15 ?? ?? ?? ns ???? ???? c in ????????????????? ????????????????? maximum input capacitance (pin 1 or pin 19) ???? ???? e ???? ???? 10 ???? ???? 10 ???? ???? 10 ?? ?? pf ???? ? ?? ? ???? c out ????????????????? ? ??????????????? ? ????????????????? maximum threestate i/o capacitance (i/o in highimpedance state) ???? ? ?? ? ???? e ???? ? ?? ? ???? 15 ???? ? ?? ? ???? 15 ???? ? ?? ? ???? 15 ?? ?? ?? pf 8. for propagation delays with loads other than 50 pf, and information on typical parametric values, see the on semic onductor highspeed cmos data book (dl129/d). typical @ 25 c, v cc = 5.0 v c pd power dissipation capacitance (per transceiver channel) (note 9.) 40 pf 9. used to determine the noload dynamic power consumption: p d = c pd v cc 2 f + i cc v cc . for load considerations, see the on semiconductor highspeed cmos data book (dl129/d).
mc74hc245a http://onsemi.com 5 v cc gnd t f t r input a or b output b or a 10% 50% 90% 10% 50% 90% t tlh t plh t phl t thl figure 3. switching waveform output enable a or b a or b 50% 50% 50% 90% 10% t pzl t plz t pzh t phz v cc gnd high impedance v ol v oh high impedance v cc gnd 50% figure 4. switching waveform direction output *includes all probe and jig capacitance c l * test point device under test figure 5. test circuit *includes all probe and jig capacitance c l * test point device under test output figure 6. test circuit connect to v cc when testing t plz and t pzl . connect to gnd when testing t phz and t pzh . 1 k w
mc74hc245a http://onsemi.com 6 figure 7. expanded logic diagram a data port b data port output enable direction a1 a2 a3 a4 a5 a6 a7 a8 2 3 4 5 6 7 8 9 19 1 b1 b2 b3 b4 b5 b6 b7 b8 18 17 16 15 14 13 12 11
mc74hc245a http://onsemi.com 7 package dimensions so20 dw suffix case 751d05 issue f pdip20 n suffix plastic dip package case 73803 issue e notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of lead when formed parallel. 4. dimension b does not include mold flash. m l j 20 pl m b m 0.25 (0.010) t dim min max min max millimeters inches a 25.66 27.17 1.010 1.070 b 6.10 6.60 0.240 0.260 c 3.81 4.57 0.150 0.180 d 0.39 0.55 0.015 0.022 g 2.54 bsc 0.100 bsc j 0.21 0.38 0.008 0.015 k 2.80 3.55 0.110 0.140 l 7.62 bsc 0.300 bsc m 0 15 0 15 n 0.51 1.01 0.020 0.040 e 1.27 1.77 0.050 0.070 1 11 10 20 a seating plane k n f g d 20 pl t m a m 0.25 (0.010) t e b c f 1.27 bsc 0.050 bsc 20 1 11 10 b 20x h 10x c l 18x a1 a seating plane h x 45 e d m 0.25 m b m 0.25 s a s b t e t b a dim min max millimeters a 2.35 2.65 a1 0.10 0.25 b 0.35 0.49 c 0.23 0.32 d 12.65 12.95 e 7.40 7.60 e 1.27 bsc h 10.05 10.55 h 0.25 0.75 l 0.50 0.90 0 7 notes: 1. dimensions are in millimeters. 2. interpret dimensions and tolerances per asme y14.5m, 1994. 3. dimensions d and e do not include mold protrusion. 4. maximum mold protrusion 0.15 per side. 5. dimension b does not include dambar protrusion. allowable protrusion shall be 0.13 total in excess of b dimension at maximum material condition.
mc74hc245a http://onsemi.com 8 package dimensions tssop20 dt suffix 20 pin plastic tssop package case 948e02 issue a dim a min max min max inches 6.60 0.260 millimeters b 4.30 4.50 0.169 0.177 c 1.20 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.27 0.37 0.011 0.015 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane -w-. 110 11 20 pin 1 ident a b t 0.100 (0.004) c d g h section nn k k1 jj1 n n m f w seating plane v u s u m 0.10 (0.004) v s t 20x ref k l l/2 2x s u 0.15 (0.006) t detail e 0.25 (0.010) detail e 6.40 0.252 --- --- s u 0.15 (0.006) t on semiconductor and are trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. atypicalo parameters which may be provided in scill c data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body , or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthori zed use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. publication ordering information japan : on semiconductor, japan customer focus center 4321 nishigotanda, shinagawaku, tokyo, japan 1410031 phone : 81357402700 email : r14525@onsemi.com on semiconductor website : http://onsemi.com for additional information, please contact your local sales representative. mc74hc245a/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 3036752175 or 8003443860 toll free usa/canada fax : 3036752176 or 8003443867 toll free usa/canada email : onlit@hibbertco.com n. american technical support : 8002829855 toll free usa/canada
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